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the effect of epoxy/glass interfaces on caf failures in

the effect of epoxy/glass interfaces on caf failures in ...

The Effect of Epoxy/Glass Interfaces on CAF Failures in ...

Previous studies, along with analysis and examinations conducted on failure sites in PCBs due to CAF, have shown that the conductive path is typically formed along delaminated or debonded glass fiber and epoxy resin interfaces. The advent of increasing board processing temperatures due to lead free soldering, dramatic miniaturization of …

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the effect of epoxy/glass interfaces on caf failures in ...

The effect of epoxy/glass interfaces on CAF failures in ...

The effect of epoxy/glass interfaces on CAF failures in printed circuit boards Bhanu Sood a and Michael Pecht a a CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University …

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the effect of epoxy/glass interfaces on caf failures in ...

The effect of epoxy/glass interfaces on CAF failures in ...

Reductions in printed circuit board line spacing and via diameters and the increased density of vias with higher aspect ratios (ratio between the thickness of the board and the size of the drilled ...

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the effect of epoxy/glass interfaces on caf failures in ...

The effect of epoxy/glass interfaces on CAF failures in ...

The effect of epoxy/glass interfaces on CAF failures in printed circuit boards Autores: Bhanu Sood , Michael Pecht Localización: Microelectronics reliability , ISSN 0026-2714, Nº. 82, 2018 , págs. 235-243

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prof. pecht's new article available free for limited …

Prof. Pecht's New Article Available Free for Limited …

Prof. Pecht's New Article Available Free for Limited Time. Prof. Pecht and Bhanu Sood, former CALCE Test Services and Failure Analysis Laboratory director, have co-authored a new article “The effect of epoxy/glass interfaces on CAF failures in printed circuit boards,” which is now available online for free here until May 22 with Elsevier Press.

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conductive anodic filament growth failure isola …

Conductive Anodic Filament Growth Failure Isola …

The Effect of Epoxy Glass Interfaces on CAF Failures in November 10th, 2018 - The effect of epoxy glass interfaces on CAF failures in printed circuit boards One failure mechanism of particular concern is

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effects of curing agents and drilling methods on caf ...

Effects of Curing Agents and Drilling Methods on CAF ...

failures caused by conductive anodic filament formation (C AF). C AF is a conductive copper-containing salt that forms via an electrochemical process. It is initiated at the anode and grows along the epoxy/glass interface to the cathode, and once CAF reaches the cathode a short circuit will occur.

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edit an examination of glass-fiber and epoxy …

EDIT An Examination of Glass-Fiber and Epoxy …

glass fiber/epoxy resin interface due to hydrolysis. Williams [6] has shown that PCBs manufactured with non- dicy Williams [6] has shown that PCBs manufactured with non- dicy cross-linked epoxy resins are more resistance to CFF failures than PCBs manufactured with dicy cross-linked epoxy

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microelectronics reliability | vol 82, pages 1-244 …

Microelectronics Reliability | Vol 82, Pages 1-244 …

select article The effect of epoxy/glass interfaces on CAF failures in printed circuit boards Research article Full text access The effect of epoxy/glass interfaces on CAF failures in printed circuit boards

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an examination of glass-fiber and epoxy interface ...

An examination of glass-fiber and epoxy interface ...

Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along which ...

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conductive anodic filament failure: a materials …

Conductive Anodic Filament Failure: A Materials …

Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper-containing filament subsurface along the epoxy-glass …

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conductive anodic filament failures in fine-pitch …

Conductive Anodic Filament Failures in Fine-Pitch …

Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates KOUSHIK RAMACHANDRAN,1,2,3 FUHAN LIU,1 P. MARKONDEYA RAJ,1

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caf resistance of non-dicy fr-4 - isola group

CAF Resistance of NON-DICY FR-4 - Isola Group

and rates of CAF failure along the resin-to-glass interface, as follows in decreasing order1: • hole-to-hole. • hole-to-feature. • feature-to-feature, in plane. • feature-to-feature, out of plane. Moisture must be present for CAF to occur.1, 2 The higher the electrical bias, the more likely and faster CAF will occur. The smaller the spacing between features …

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prof. pecht's new article available free for limited …

Prof. Pecht's New Article Available Free for Limited …

Prof. Pecht and Bhanu Sood, former CALCE Test Services and Failure Analysis Laboratory director, have co-authored a new article “The effect of epoxy/glass interfaces on CAF failures in printed circuit boards,” which is now available online for free here until May 22 with Elsevier Press. No sign up, registration, or fees are …

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hkpca journal issue 21 - ektpcb.com

HKPCA Journal Issue 21 - ektpcb.com

progress on the subsurface toward the cathode, frequently along the epoxy/glass fiber interface. They cause They cause catastrophic failure if allowed to bridge between the anode and the cathode.

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conductive filament formation failure in a printed circuit ...

Conductive filament formation failure in a printed circuit ...

A defective printed circuit board assembly that exhibited excessive current leakage was examined to determine the responsible failure mechanisms. Observation of the failure site (determined electrically) by optical and electron microscopy revealed an area in the circuit board where debonded fiber bundles bridged a plated‐through‐hole (PTH ...

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hkpca journal no

HKPCA Journal No

Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament, a copper salt, grows from anode to cathode along the epoxy-glass

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investigation of copper plated-through-holes in …

Investigation of copper plated-through-holes in …

trochemical migration of copper along epoxy-glass fiber interface is referred to as conductive anodic filament (CAF) failure. The CAF failure mode involves the separation of the glass fiber and resin interface followed by electro-chemical migration of copper along the interface resulting in electrical insulation failures [7]. The kinetics of copper

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conductive anodic filament (caf) formation: an …

Conductive anodic filament (CAF) formation: An …

Conductive anodic filament (CAF) formation, a failure mode in printed wiring boards (PWBs) exposed to high humidity and high voltage gradient, has caused catastrophic field failures.

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stability of epoxy/glass interfaces - lehigh preserve

Stability of epoxy/glass interfaces - Lehigh Preserve

Appendix 2 Percent failure and Gle of DCB specimens treated by 95 polymeric adhesion promoters Appendix 3 Study of subcritical crack growth of epoxy/glass interfaces 97

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